There are two standardized models; the FA-2E, a lateral type for a low flow rate, and the FA-40VEW, a vertical type for a high flow rate. The FA-2E employs a spray system for single wafer processing while the FA-40VEW is suitable for cleaning 200/300 mm wafers.
H-shaped thick bellows are used (Only FA-40VEW). They have excellent resistance to high pressure and a long life to withstand continuous long-time operation. When connected to a special controller, the discharge can be controlled and monitored easily.